Phoenix
Atomic Layer Deposition (ALD) solutions

- High Productivity Batch Mode Coat up to five GEN 2.5 substrates, multiple wafer cassettes, and large 3D objects
- Low Cost of Ownership made possible by low startup and operational costs and compact footprint
- Precise Software Control of process parameters including temperature, flow, and pressure
- High (4000) hours Mean Time Between Failures (MTBF)